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Muti-Layer Jet Applied in H200 Cold Plate,The Thermal Resistance (Junction-Fluid) is Less Than 0.035°C/W

Muti-Layer Jet Applied in H200 Cold Plate: The thermal resistance (junction-to-fluid) is less Than 0.035 °C/W
    Time2025
    Products Used
    NVIDIA H200:8 GPU+ 4 Switch chip
    TDP: GPU700W×8+Switch186W ×4
    Flow rate:10LPM
    Flow resistance: <40Kpa
    Input fluid temperature:25-30℃


    Project Description
    1.Multi-layer jet cooling Microchannel,the Unique Spray structure and fluid distribution technology.
    - Rjf<0.035℃/W , lower than competitors 15+%.
    - ∆P<15Kpa,Lower than competitors 20+%.
    2.The unique process innovation,yield≥99%, processing hours ↓ 25+%,the cost competitiveness↑ 50+%.
    3.Advanced test equipments and strict acceptance standards,"zero leakage"

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