DIMM Liquid Cooling Product
(Heat Pipe solution)
Interface Material:
High compression ratio, high thermal conductivity, and resistance to plugging and unplugging.
Heat Pipe Cold Plate Structure:
Overall pressure drop < 28 kPa, solving the pressure drop issue of conventional liquid-cooled cold plates.
Custom Thick-walled Heat Pipes:
Balances the structural strength and heat dissipation performance of the device.
| Key Parameters | Parameter Description | ||
| Dimensions | 2U | ||
| Coolant | DI water, PG25 | ||
| Inlet Temperature | 40 ℃ | ||
| Flow Rate | 1 | ||
| Pressure Drop | ≤ 28 kPa | ||
| Total Power Consumption | 1384 W | ||
| DIMM Power Consumption | 36.4 W*40 | ||
| DIMM Tcase | 68 ℃ | ||
| Quick Connector | UQD04 Socket | ||
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Note: Performance may vary depending on operating conditions. For data not listed, please contact TeraCule. |
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