IAFA Cold Plate
(Independent Adaptive Floating Array)
Integrated Structure:
Integrated with the cage, designed to adapt to high-density switch chassis environments.
Reliable Insertion & Extraction:
Customizable insertion and extraction force (20–40 N). The internal water pressure and floating mechanism are separated, enabling smooth and unobstructed insertion and extraction.
Proprietary Floating Bellows Structure:
Independently floating, with a maximum stroke of 0.8 mm.
High Performance, Safety & Reliability:
Heat dissipation capacity exceeds 43 W, achieving industry-leading performance.
| Key Parameters | Parameter Description | ||
| Dimensions | 2U | ||
| Coolant | DI water, PG25 | ||
| Inlet Temperature | 40 ℃ | ||
| Flow Rate | 7.3 LPM | ||
| Pressure Drop | ≤35 kPa | ||
| Switch Chip Tcase | 69.7 ℃ | ||
| Switch Chip Thermal Resistance | ≤0.02 ℃/W @ 2 LPM | ||
| Switch Chip Power Consumption | 1663 W | ||
| Optical Module Cold Plate Tcase | 65.8 ℃ | ||
| Optical Module Cold Plate Thermal Resistance | ≤0.8 ℃/W @ 1.2 LPM | ||
| Optical Module Cold Plate Power Consumption | 43 W*64 | ||
| Optical Module Cold Plate Quantity | 64 | ||
| VPD Power Consumption | 151.8 W | ||
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Note: Performance may vary depending on operating conditions. For data not listed, please contact TeraCule. |
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