TeraCule OCP Integrated Rack Solution-Solutions-TeraCule

Solution Introduction

Next-gen ORV3-compliant infrastructure for AI acceleration. High-density, efficient, and modular platform for hyperscale environments.

Extreme Density: 140 kW-600 kW per rack capacity for Al workloads.

Power Efficiency: Native 48 V DC bus + liquid cooling for ultra-low PUE.

Hybrid Support: Universal 19"/21" support; up to 48 RU capacity.

Modular Ecosystem: Integration: Power Shelf, BBU, CDU, and RDHX modules.

Load Management: Peak power shaving for Al surges; 1,400 kg static load.

Rapid Deployment: Blind-mate manifolds & 100 % front-access service.

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